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  • 860 Pressure Curing Oven

860 Pressure Curing Oven (PCO)

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

  • PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
  • Heaters, heat exchangers and blowers are internal to the pressure vessel.
  • When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools.

Process Specification:

  • Process time: Generally 120 min or User's spec
  • Operating temp: 60oC ~ 200oC
  • Maximum temp: 220oC
  • Operating pressure: 1 bar - 10 bar
  • Capacity: 24 Magazines (typical)
  • Cooling method: PCW (17oC - 23oC)
  • Cooling water pressure: 25 - 40 psi

Pressure Cure Applications:

  • Composite Forming for the printing industry
  • Die Attach Curing
  • Wafer Laminating
  • Thermal Compress Bonding
  • Underfill Curing
  • Via Filling
  • Film & Tape Bonding

Learn More


Heller Pressure Curing Oven

System Air Flow

PCO System Air Flow

Vacuum Module Option

PCO Vacuum Module Option

Chamber Dimensions

Chamber Dimensions

PCO System Dimensions

PCO System Dimensions

PCO System Chamber

PCO System Chamber

Chamber with shelves extended

PCO System Chamber open

Representative Pressure/Temp Profiles (User Configurable)

Representative Pressure/Temp Profiles

See Heller Reflow Oven in Action