REFLOW SOLDERING SYSTEMS FOR SMT

Worldwide Sales & Service Network 63 Locations, Covering 26 Countries

As pioneers in developing convection oven technology, we invite you to share your SMT reflow and curing application needs with us. To discover the benefits of doing business with Heller Industries, Click here for more information.

 

System Features:

  • The most efficient heat transfer, from extra high-volume, high-velocity, heating modules, producing temperature gradients of less than 2oC throughout the oven.

  • Instant-response heating modules that react in less than one second to temperature changes of less than 0.1oC to maintain profile integrity for heavy board loads

  • Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment with our Gen. 5 Flux Separation option.

  • The lowest nitrogen consumption in the industry: 350 SCFH with our UltrafLOW option.

  • Six-sigma reliability for the most demanding production environments.

  • Single or dual-rail edge hold conveyor for greater versatility in board handling.

  • User-friendly WindowsTM software.

  • Alternate curing configuration, with topside IR panels to create a temperature differential that protects heat-sensitive components.

  • An optional UV module may be added for UV cure adhesives.

Reduced Maintenance Features:

  • Computer-controlled automatic lubrication system for "hands-off" maintenance.

  • Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels.

  • Recirculating warm water cooling system reduces flux condensation on the heat exchanger and traps flux in the filter - extending maintenance intervals by up to 300%.