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1826 Mark 5 - Reflow Oven System

The World's Best Convection Reflow Oven

Providing consistent performance for high volume requirements while minimizing preventative maintenance and floorspace

Mark 5 Series SMT Reflow Oven System

The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5 system not only the premier reflow soldering system but the best overall value in the industry!

2011 Winner for Best New Product

Innovation for Your Benefit

Advancements like the invention of the first waterless / filterless flux separation system earned Heller the prestigious Frost & Sullivan Award for Innovation in reflow soldering. But more importantly, this development extended preventative maintenance intervals from weeks to months for our systems. Additional breakthroughs in energy management have helped Heller's customers remain environmentally responsible while still maintaining their sustainability guidelines.

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Features and benefits of Mark 5 series SMT reflow system

New Cool Pipe Flux System Virtually Eliminates Maintenance

Our new Cool Pipe flux collection system traps the flux in collection jars that can easily be removed and replaced while the oven is running - thus saving time consuming P.M. Additionally, our proprietary Flux-Free Grill System limits flux residue on the cooling grills - the result is not only reduced maintenance time, but recaptured production time - giving the Heller system the highest production yields of any oven!

Enhanced Heater Modules

Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!

One-Step Profiling

Developed in partnership with KIC, you can now have instant profile settings by simply entering the length, width and weight of your PCB. An extensive profile and paste library with dynamic structure does the rest of the work for you!

Fastest Cooling Rates

The new Blow Thru Cooling module provides cool rates of >3º C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements!

Process Control

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy. [more]

Energy Management Software - A Heller Exclusive!

Proprietary software allows you to program exhaust draw to optimize energy consumption during the various production times - heavy, light or idle.

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