• »
  • Curing & Back-end Semiconductor Manufacturing

Curing & Back-end Semiconductor Manufacturing

Increase productivity, improve quality, reduce costs... with curing & back-end semiconductor solutions from Heller.

Customized ovens for a variety of curing needs

With the largest installed base of US-made in-line vertical ovens in the world, Heller is the preferred choice of many leading electronics manufacturers. Just as we pioneered SMT solder reflow advances... including full convection and economical nitrogen usage... we are now the first to offer a family of customized ovens for a variety of curing needs. As a market leader, Heller has the versatility, flexibility and engineering capabilities to develop custom solutions for your individual curing requirements.

Heller's global customer base knows it can depend on our reliable equipment... continuous innovation... and responsive engineering. We provide a global service network, supported by a 24-hour beeper number. And we offer leading-edge support through RMATS (Remote Modem-Accessible Technical Service). This state-of-the-art system enables our service engineers to access your oven's internal electronics and answer your questions, wherever you are, whenever you have a concern.

Learn More

Heller Advanced Curing Equipment - Choose a Curing Oven

788 Vertical Oven for Back End Semiconductor

Heller 788 Vertical Curing Oven

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

788 Vertical Curing Oven

1826 Mark 5 Series SMT Reflow System

Heller 755 Mini Vertical Curing Oven

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput.

755 Mini Vertical Curing Oven

Pressure Curing Oven

Heller 860 Pressure Curing Oven (PCO)

A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

PCO Pressure Curing Ovens

Back End Semiconductor Curing Ovens Quick Facts:

Curing Oven Models

Cycle Time / Belt Speed

788 Vertical Oven - Back End Semiconductor

18 - 45 seconds per 300mm carrier

755 Mini Vertical Oven - Back End Semiconductor

25 - 60 seconds per 150mm carrier

Pressure Curing Oven 860 - Back End Semiconductor

Up to 180 cm per minute on fixtures PCB up to 18" wide

See Heller Reflow Oven in Action