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Voidless / Vacuum Reflow Soldering

1809 Mark III - Heller Advanced In-Line Vacuum Reflow Oven

Heller Voidless / Vacuum Vacuum Reflow Oven

In-Line Vacuum Reflow Concept

Vacuum chamber open

Nitrogen System with Balanced Flow Technology

  • 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry!
  • 100" Heated Length - for super throughput!
  • 2 Internal Cooling Zones - gives lowest exit temperature!
  • 180" Total Length - optimizes floorspace utilization!
  • NEW Module Design with 10" modules gives the flexibility to subdivide the profile into smaller segments and allows for more refined "profile sculpting". The only way to satisfy demanding Lead Free Applications!
  • Reflow zones configured for Lead Free Soldering as well as Eutectic requirements.
  • Nitrogen Inert Atmosphere To 10 PPM with 50% reduction in N2 consumption !
  • AWARD WINNING Flux Separation System
    • Fitlerless Flux Separation System
    • Water Cooling Option To Increase Cooling Rate
    • "Easy Clean" Mode That Only Takes 30 Minutes
  • Oxygen Monitoring With Closed Loop Control for tightest process control!
  • Oven Cpk Reporting Software - Powered by ECD, this SPC package gives real time Cpk info on your process - A STANDARD FEATURE at No additional charge!

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1936 MKV vacuum reflow oven.

See Heller Reflow Oven in Action